[ad_1]
Foundry leader TSMC (2330-TW) ADR hit a new record Monday and became the world’s 10th largest company by market capitalization, closely following Tesla (TSLA-US), which ranked 9th; continued in the foundry position in advanced process technology. Under the leadership, TSMC’s advanced process production capacity is in short supply. Apple, Intel and other major foundry orders are expected to continue to invest, and joint development of advanced packaging technology with Google is said to achieve strong business performance and stable profitability. The legal entity noted that TSMC’s global market value ranking is expected to continue. Moving forward and outperforming Tesla is just around the corner.
According to foreign media reports, Apple will expand its self-developed chips. In addition to launching the Mac series equipped with its own M1 processor this year, it will launch a series of self-developed Mac chips next year. Major chip foundry TSMC is expected to benefit and continue to become one of the main drivers of operating growth.
On the other hand, processor leader Intel (Intel) has frequently reported that it will outsource the chips to the TSMC foundry. Recently, Intel also revealed on the official Qiucai website that in addition to being responsible for the foundry of Xe-HPG GPU and Xe-HPC chips, TSMC will also help Intel produce Atom and Xeon series SoC chips. Foreign investors also noted that Intel has already delivered 180,000 GPU die casting orders by 2021 to TSMC for 6nm production. Moving forward, TSMC will use a 3nm process to produce chips for the Intel foundry.
As major customers rush to receive orders, TSMC’s 5-nanometer process is fully loaded and its production capacity is low. Next year it will increase up to three times. This year’s 5 nanometer process will account for about 8% of revenue and at least 20% next year; The latest report from the TrendForce organization is even more optimistic: TSMC is expected to capture nearly 60% of the advanced process market share by the end of next year.
Additionally, TSMC has also made great strides in advanced packaging technology, integrating 3DIC technology platforms such as SoIC (System Integration Chip), InFO (Integrated Fan Packaging Technology), CoWoS (Chip-on-Substrate Wafer-on-Wafer Packaging ) as 3D Fabric. Serving the high-end packaging needs of customers at the top of the pyramid, such as Google and Supermicro, and it is reported that they are jointly developing SoIC packaging technology with Google, and the advanced packaging production capacity will be built on the next year and mass production will be in 2022.
In terms of advanced process progress, after TSMC’s 5-nanometer mass production this year, Nanke’s 3-nanometer wafer fab 18 was launched at the end of November. Mass production is expected in the second half of 2022. The goal is when 3 nanometers go into mass production. , The annual production capacity will exceed 600,000 12-inch wafers.
[ad_2]
