7nm catching up with TSMC’s 3nm Intel CPU process is still the Intel Intel



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In 2019, Intel overtook Samsung and regained the status of a brother in the global semiconductor market. Intel has maintained this list for 25 years for the past 27 years. In the next step, Intel has to catch up on semiconductor technology: its 7nm process transistor density is close to TSMC’s 3nm process, and the 5nm node overtaking is almost pinned.

In naming semiconductor process nodes, TSMC and Samsung have moved a bit away from the 16 / 14nm node. They have not gone strictly according to the definition of the ITRS Association, and the naming of nodes has become a joke. Intel is very good at this Honestly, so it suffers a lot.In fact, its 10nm node transistor density is 100m / mm2, which is slightly higher than Samsung and TSMC’s 7nm.

After 10nm is on the right track, Intel announced that the development of its semiconductor process will return to the 2-year cycle. Mass production of the 7nm process will be in 2021. The first high-performance Xe architecture GPU will be expanded to more in 2022. CPU and other products.

TSMC officially announced the details of the 3nm process last week. The transistor density of this process has reached 250 million / mm2. It is expected to enter the risk test production stage in 2021 and mass production in the second half of 2022.

What about Intel 7nm level and below processes? Official details have yet to be announced, but Intel’s scale from 22nm to 14nm is 2.4x, and from 14nm to 10nm is 2.7x, both of which exceed Moore’s Law 2x process scale level.

Intel CEO Siribo mentioned that the 7nm process will scale normally, which is at least 2x to 2.4x, meaning that the transistor density of the 7nm process will reach 200 million / mm2 to 240 million / mm2.

In this way, if it is the 240 million / mm2 level, then the Intel 7nm process can reach the TSMC 3nm process level. If it is conservative a little 200 million / mm2, it is also very close.

Don’t forget that after 7nm, Intel will enter the 5nm node. The time point will be in 2023, according to the Intel level, at least 2x of scale, then the density of the transistor will reach at least 400 million / mm2, far exceeding TSMC’s 3nm process level. 2nm of TSMC should not be missed before 2023.

Current calculations remain theoretical, but as long as the Intel process path returns to normal, it is not surprising that the advanced process is back. TSMC and Samsung cannot underestimate the technical strength of the semiconductor brother.

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