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The place 91mobiles today released details of Qualcomm’s next mobile platform, the Snapdragon 875. The chip is expected to equip the best top-of-the-line 2021 phones, and will likely be announced later in the year, when the Snapdragon Summit usually occurs.
Named SM8350, the Snapdragon 875 should bring the Kryo 685 cores, based on TSMC’s 5nm N5 process, accompanied by the Adreno 660 GPU and the Spectra 580 ISP. The performance level of the chip is still unknown, but considering lithography exchange at least, good gains in energy efficiency are expected.
One of the main innovations of the platform is the 5G X60 modem, which will support the mmWave and Sub-6 standards. There is still no confirmation on whether the modem will be integrated or optional, on the line of the current X55. Other chipset configurations also include:
- Adreno 665 VPU
- LPDDR5 Four-Channel High-Speed Packet-in-Packet (PoP) SDRAM
- Adreno 1095 DPU
- Snapdragon Sensors Core technology
- Qualcomm Secure Processing Unit (SPU250)
- Low Power Audio Subsystem with Aquatic Audio Technologies (WCD9380 eWCD9385 Codecs)
The Snapdragon 875 is also expected to continue to introduce features present in Qualcomm’s current lineup, such as the ability for manufacturers to update chip drivers through app stores. Xiaomi was the first to use the technology, rolling out updates for the Mi 10 line and the Redmi K30 Pro in China.
It’s worth remembering that Qualcomm must meet strong competition from Samsung next year, at least regarding the GPU of the new Exynos. The South Korean uses GPU with AMD technology in his next chipset, which in leaked tests showed three times the performance found in the Adreno 650 in the Snapdragon 865.
