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AMD USA announced the Ryzen 5000 series that adopted the latest Zen 3 architecture on the 8th (local time). Among them, Mark Papermaster, the company’s chief technology officer and executive vice president of technology and engineering, provided a roadmap for “Zen 4,” which is alongside Zen 3.
The company began developing an architecture five years ago to realize a family of high-performance x86 CPUs. The goal is simply to get total leadership. Therefore, we were able to internally establish a team structure that can simultaneously continue to develop processors for multiple generations, jump on the previous generation (Leapfrogging) and bring the (evolved) processor to market as promised. That is to say.
The original Zen architecture achieved a 52% improvement in IPC compared to the previous generation. This creates a solid foundation for the Zen family. And in 2019 Zen 2, in addition to achieving double-digit IPC improvement, the chiplet architecture has made the core smaller so that it can be easily manufactured even with the latest manufacturing process. 7nm, achieving excellent multi-core performance and core density. It has high scalability with a large number of cores.
Zen 3 claims that it was able to improve every part of the same 7nm, achieving higher clock, IPC and lower latency.
And we are committed to continuing to develop processors to provide our customers with the best possible experience. This time, we managed to ship Zen 3, but revealed that development of the 5nm “Zen 4” process is progressing as planned. Zen 4’s shipping date has not been revealed, but it is expected to launch in 2022 due to the number “2022” on the slide.
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