The first phone with a Snapdragon 888 chipset is now official with the launch of Xiaomi’s Mi 11 yesterday in China. Xiaomi’s new flagship has quickly found its way among local tech bloggers and teardown experts. Aiao technology He decided to take it apart and show us what it looks like inside.
As with all teardowns, this one begins by removing the SIM tray located at the bottom near the USB-C port. Then it’s time to open the adhesive-free eco-leather plastic back and remove some screws that hold the camera’s sensor cover. The main 108MP sensor is Samsung’s ISOCELL HMX that comes with OIS, it is paired with a 5MP Samsung S5K5E9, while the 13MP ultra-wide module is OmniVision’s OV13B10 CMOS.
Xiaomi Mi 11 teardown (credit: Aiao Technology)
The motherboard is covered with a large amount of copper foil on the front and rear and it also has various heat sinks to improve thermal performance. After removing the copper bits, we can see the new Snapdragon 888 chipset along with the flash memory and both are sealed with adhesive in case of liquid exposure. The 4,600 mAh battery is courtesy of Sunwoda Electronics Co Ltd.
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