PHILO PHOTO: A man stands near an IBM logo at the Mobile World Congress in Barcelona, Spain, February 25, 2019. REUTERS / Sergio Perez
(Reuters) – International Business Machines Corp (IBM.N) announced Monday a new data center processor chip that it says it can handle its predecessor’s workload three times.
The IBM-designed Power10 chip will be manufactured by Samsung Electronics Co Ltd (005930.KS) and is intended for use by companies within data centers, IBM said.
The chip will use Samsung’s 7-nanometer chip processing process, which is similar to the 7-nanometer technology used by Advanced Micro Devices Inc (AMD.O) used to make its chips by Taiwan Semiconductor Manufacturing Co Ltd (2330.TW).
Both IBM and AMD use outside chip factories to compete against Intel Corp., the dominant supplier of central processor chips in data centers and one of the few remaining players that both designs and manufactures its own chips.
Intel recently said that its next generation of manufacturing technology is facing delays, prompting analysts to believe their rivals could win a market share.
IBM has long focused on high-performance computer systems, with three of the world’s top ten fastest supercomputers using its chips. The company said Monday that the Power10 chip is designed to be faster at computing tasks for artificial intelligence than its predecessor, and does such work up to 20 times faster than its previous generation chip.
Report by Stephen Nellis in San Francisco; edited by Diane Craft
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